OEM Aluminum Extrusion 5G Station Heat Sinks
Our comb-style CPU cooler features precision aluminum heat sink extrusion technology for superior thermal performance. The advanced aluminum extrusion heat sink design maximizes surface area with tightly arranged fins, while maintaining excellent structural durability.
Crafted from premium aluminum heat sink material, this solution delivers optimal cooling for your heat sink in computer systems. The innovative comb-shaped fin array promotes efficient heat dissipation, keeping your processor at ideal operating temperatures.
Key features:
– High-density fin structure for enhanced cooling
– Lightweight extruded aluminum construction
– Easy installation on most CPU sockets
– Cost-effective thermal solution
Product Overview
Comb-shaped heat sinks utilize a parallel fin array design to maximize surface area and improve air convection efficiency, making them ideal for electronic devices requiring passive cooling or forced air cooling. Customizable aluminum and copper materials are available, along with a variety of surface treatments, catering to a wide range of applications, including consumer electronics, automotive, and communications.
Core Advantages
- Efficient heat dissipation: Adjustable fin density (5-30 fins/inch) increases heat dissipation area by over 40%.
- Lightweight: Aluminum weighs only one-third of a steel heat sink of the same volume.
- Vibration resistance: Unibody construction makes it suitable for automotive and industrial applications.
- Flexible customization: Supports custom pitch, height, and baseplate shapes.
Technical Specification
| Parameter | Value Range | Notes |
|---|---|---|
| Standard Fin Height | 5-50mm | Customizable up to 100mm |
| Base Plate Thickness | 2-10mm | Adjustable based on thermal requirements |
| Operating Temperature | -50°C to 300°C | Material dependent |
| Thermal Resistance | 0.1-2.0°C/W | Test condition: 25°C ambient |
| Surface Roughness | Ra≤1.6μm | Standard process |
Material Selection Guide
| Material | Thermal Conductivity (W/m·K) | Density (g/cm³) | Temp. Range | Typical Applications | Cost Index |
|---|---|---|---|---|---|
| 6061 Aluminum | 150-180 | 2.7 | -50°C~150°C | Consumer Electronics, LED | |
| Copper C1100 | 380-400 | 8.9 | -200°C~300°C | High-power Chips, Lasers | |
| AlSiC | 180-200 | 3.0 | -50°C~200°C | RF Semiconductor Packaging | |
| Titanium Alloy | 15-20 | 4.5 | -270°C~600°C | Aerospace |
Typical Application Scenarios
1. Electronics and Power Industry
Typical Equipment: IGBT modules, power inverters, LED drivers
Solution: 6063 aluminum alloy + anodizing, 15mm tooth height, with thermal grease for direct contact with heat sources
2. New Energy Vehicles
Typical Equipment: Onboard Chargers (OBCs), Battery Management Systems (BMSs)
Solution: Copper-aluminum composite brazed heat sink with corrosion-resistant nickel plating, operating temperature range -40°C to 150°C
3. 5G Communications Equipment
Typical Equipment: AAU radio frequency units, optical modules
Solution: High-density aluminum comb teeth (20 per inch) + forced air cooling, thermal resistance ≤ 0.5°C/W
4. Consumer Electronics
Typical Equipment: Gaming laptop CPUs, graphics cards, and router chips
Solution: Ultra-thin copper heat sink (1.5mm thick) with gold plating to reduce contact thermal resistance
Surface Finish Options
| Treatment | Applicable Materials | Key Features | Typical Applications | Additional Cost |
|---|---|---|---|---|
| Anodizing | Aluminum | Corrosion-resistant, insulative, color options | Consumer Electronics | +5-8% |
| Nickel Plating | Copper/Aluminum | Oxidation-resistant, improves solderability | Automotive Electronics | +10-15% |
| Sandblasting | All Metals | Enhanced radiation, anti-fingerprint | Industrial Equipment | +3-5% |
| Conductive Oxidation | Aluminum | EMI Shielding | Communication Devices | +12-18% |
| PVD Coating | All Metals | High wear-resistance, decorative | Premium Consumer Products | +20-30% |
Customization Services
- Requirements Analysis: Provide parameters such as heating power, installation space, and environmental conditions.
- Thermal Simulation Design: CFD fluid dynamics analysis (optional value-added service).
- Sample Production: Samples (including test reports) are available within 5-15 working days.
- Small-batch trial production: Minimum order quantity (MOQ) of 50 pieces.
- Mass Production: Standard delivery time is 15-30 days, with expedited service available.
FAQs
What are the advantages of a comb-type heat sink over other types?
Comb-type heat sinks use parallel fins, resulting in a larger heat dissipation area and lower airflow resistance, making them suitable for directional airflow applications. Compared to pin-fin heat sinks, they offer higher heat dissipation efficiency for the same volume, and compared to flat-plate heat sinks, they offer better natural convection.
How do I choose the right material?
Aluminum alloy heat sink(such as 6061/6063): Highly cost-effective, suitable for low- to medium-power applications (such as consumer electronics and LED lighting).
Red copper heat sink(C1100): Optimal thermal conductivity, suitable for high-power chips (such as CPUs, GPUs, and lasers), but at a higher cost.
Aluminum silicon carbide (AlSiC): Matches the thermal expansion coefficient of the chip and is suitable for high-frequency semiconductor packaging.
Titanium alloy: Corrosion-resistant and high-temperature resistant, suitable for aerospace and special environments.
Is a fan required?
Natural heat dissipation: Suitable for applications with heat dissipation less than 10W/cm² (such as routers and LED lighting).
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