Sunflower Heat Sink LED Heat Sink Aluminum Heat Sink Radiator
The LED Sunflower Heatsink is a high-performance cooling solution designed specifically for high-power LED lamps. Its unique radial fin structure significantly improves heat dissipation. Its name derives from the fact that the fins, shaped like sunflower petals, radiate evenly from a central base, creating dense heat dissipation channels that significantly increase the contact area with the air, accelerating heat dissipation.
Sunflower Heat Sink LED Heat Sink Aluminum Heat Sink Radiator
Product Overview
The sunflower-shaped heat sink features a radial fin design that maximizes surface area for improved natural convection efficiency, balancing compactness with high-performance heat dissipation. It’s suitable for passive or active cooling of high-power electronic components.
Core Advantages
- 360° Radiant Cooling – Bionic petal layout increases heat dissipation area by over 30%
- Lightweight Design – Made of aluminum alloy, weighs only 60% of traditional heat sinks
- Compatible – Customizable sizes and surface finishes supported
- Quiet Operation – Fanless design, noise level ≤10dB (passive version)
Technical Specification
Parameter | Standard Model (AL-6063) | High-Performance Model (Cu-Al Hybrid) |
---|---|---|
Thermal Conductivity | 180-200 W/(m·K) | 220-250 W/(m·K) |
Fin Height | 15-50mm (Customizable) | 20-60mm (Customizable) |
Base Thickness | 3-10mm | 5-12mm (Copper Base) |
Operating Temperature | -40℃ ~ 150℃ | -50℃ ~ 200℃ |
Surface Roughness | Ra≤0.8μm | Ra≤0.5μm (Nickel Plated) |
Typical Application Scenarios
1. Consumer Electronics
LED Lighting: High-Power LED Car Lights, Stage Lighting Cooling
Home Appliances: Inverter, Power Adapter Cooling Modules
2. Industrial Equipment
Power Electronics: IGBT Module, Inverter Cooling
Communications Base Stations: 5G RF Device Cooling
3. Automotive Electronics
New Energy Vehicle Motor Controllers
Onboard Charger (OBC) Cooling
4. Special Applications
Medical Equipment Cooling (e.g., Laser Therapy Devices)
High-Temperature Design for Military Electronic Equipme
Material Selection Guide
Material Type | Application Scenario | Cost-Effectiveness | Processing Method |
---|---|---|---|
Aluminum 6063 | Medium-low power, cost-sensitive projects | ★★★★★ | Extrusion |
Pure Copper C1100 | Extreme high heat flux scenarios | ★★☆ | CNC Precision Machining |
Copper-Aluminum Hybrid | High-performance cost-effective solutions | ★★★★☆ | Welding/Skiving Process |
Graphene Coating | Ultra-thin lightweight requirements (Custom) | ★★☆ | CVD (Chemical Vapor Deposition) |
Surface Finish Options
1. Anodizing (Aluminum): Available in black, silver, or other custom colors for enhanced corrosion resistance
2. Nickel Plating (Copper): Anti-oxidation, suitable for high-humidity environments
3. Sandblasting: Improves surface roughness and optimizes heat radiation efficiency
4. Ceramic Coating: Suitable for insulation applications (customization required)
Customization Services
- Dimensional customization: Adjust fin height, baseplate thickness, and outer diameter
- Structural optimization: Add heat pipe insertion holes/fan mounting areas
- Special testing: Provide thermal resistance test reports (according to ASTM D5470)
Why choose our Sunflower Radiator?
- 15 years of experience in cooling solutions, serving leading customers such as Huawei and BYD
- Fully automated production line, with a tolerance of ±0.1mm
- 72-hour sample delivery, supporting small-batch trial production
FAQs
What are the advantages of a sunflower-shaped heat sink compared to a standard fin heat sink?
The radial structure provides a larger heat dissipation area within the same volume, making it particularly suitable for applications where space is limited but high heat dissipation is required.
Does it require a fan?
It depends on the power consumption—for ≤50W, passive cooling is acceptable; for >50W, a fan is recommended (we offer integrated solutions).
Can it be used in humid outdoor environments?
We recommend nickel-plated or anodized versions, which offer IP54 protection.
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